Laser Micromachine -Hole Drilling-

KORTherm Science provides a laser drilling system which uses the excimer, DPSS and CO2 laser to drill hoes with high precision, into ceramics, polymers, glasses, wafers and PCBs. The laser processing system can help eliminate cracks or damage caused to the reverse side, caused during the machine processing, for extremely thin sheets with a thickness of 200um, such as wafers and polymer films, while making it possible for the micro-machining to take place with high precision and productivity.

• Inkjet nozzle drilling
• Via hole drilling in PCB
• Alumina drilling
• Packing film drilling